Phil Bond

Phil Bond is one of America’s most honored technology policy experts. A former US Undersecretary of Commerce for Technology, his 25-plus year career in Washington has included numerous recognitions for his leadership roles in the Executive branch, on Capitol Hill, at major high technology companies, and most recently as the CEO of TechAmerica, the largest technology advocacy association in the US.

Bond has been accorded numerous accolades during his 25-plus years in Washington, DC, including being named to the Federal 100, the annual listing by Federal Computer Week of the most influential people in government technology; named one of the Top 50 Tech Leaders of 2003 by Scientific American magazine for his policy leadership around nanotechnology; and was elected Deputy Chair of the World Information Technology and Services Alliance, a federation of more than 70 national technology associations around the world.

From 2001 to 2005, Bond was Under Secretary of the U.S. Department of Commerce for Technology and, from 2002-2003, served concurrently as Chief of Staff to Commerce Secretary Donald Evans. In his dual role, Bond worked closely with Secretary Evans to increase market access for U.S. goods and services and further advance America’s technological leadership at home and around the world. He oversaw the operations of the National Institute of Standards and Technology (NIST), the Office of Technology Policy, and the National Technical Information Service. During his tenure, the Technology Administration was the pre-eminent portal between the federal government and the U.S. technology industry.